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Investigation on Replication of Microfluidic Channels by Hot Embossing

dc.contributor.author Arikan, M. A. Sahir
dc.contributor.author Cogun, Ferah
dc.contributor.author Yildirim, Ender
dc.contributor.authorID 31835 tr_TR
dc.contributor.other 01. Çankaya Üniversitesi
dc.contributor.other 06. Mühendislik Fakültesi
dc.contributor.other 06.06. Makine Mühendisliği
dc.date.accessioned 2020-02-28T07:09:52Z
dc.date.accessioned 2025-09-18T12:06:21Z
dc.date.available 2020-02-28T07:09:52Z
dc.date.available 2025-09-18T12:06:21Z
dc.date.issued 2017
dc.description Yildirim, Ender/0000-0002-7969-2243 en_US
dc.description.abstract In this study, effects of embossing temperature, time, and force on production of a microfluidic device were investigated. Polymethyl methacrylate (PMMA) substrates were hot embossed by using a micromilled aluminum mold. The process parameters were altered to observe the variation of replication rate in width and depth as well as symmetry of the replicated microfluidic channels. Analysis of variance (ANOVA) on the experimental results indicated that embossing temperature was the most important process parameter, whereas embossing time and force have less impact. One distinguishing aspect of this study is that, the channels were observed to be skewed to either side of the channel depending on the location of the protrusions on the mold. The mechanism of the skewness was investigated by finite element analysis and discussed in detail. Results showed that the skewness depends on the flow characteristics of the material and could be reduced by increasing the embossing temperature. The best replication rates were obtained at parameter settings of 115 degrees C, 10kN, and 8min for the molds with minimum 56 mu m wide features of 120 mu m depth. We also showed that the fabricated channels could be successfully sealed by solvent-assisted thermo-compressive bonding at 85 degrees C under 5.5kN force. en_US
dc.identifier.citation Çoğun, Ferah; Yıldırım, Ender; Arıkan, M.A. Sahir, "Investigation on replication of microfluidic channels by hot embossing", Materials And Manufacturing Processes, Vol.32, No.16, pp.1838-1844, (2017). en_US
dc.identifier.doi 10.1080/10426914.2017.1317795
dc.identifier.issn 1042-6914
dc.identifier.issn 1532-2475
dc.identifier.scopus 2-s2.0-85019191098
dc.identifier.uri https://doi.org/10.1080/10426914.2017.1317795
dc.identifier.uri https://hdl.handle.net/123456789/10860
dc.language.iso en en_US
dc.publisher Taylor & Francis inc en_US
dc.rights info:eu-repo/semantics/closedAccess en_US
dc.subject Bonding en_US
dc.subject Channel en_US
dc.subject Embossing en_US
dc.subject Hot en_US
dc.subject Microfluidics en_US
dc.subject Plastic en_US
dc.subject Pmma en_US
dc.subject Replication en_US
dc.title Investigation on Replication of Microfluidic Channels by Hot Embossing en_US
dc.title Investigation on replication of microfluidic channels by hot embossing tr_TR
dc.type Article en_US
dspace.entity.type Publication
gdc.author.id Yildirim, Ender/0000-0002-7969-2243
gdc.author.institutional Çoğun, Ferah
gdc.author.institutional Yıldırım, Ender
gdc.author.scopusid 56789993500
gdc.author.scopusid 36165070100
gdc.author.scopusid 7004588941
gdc.author.wosid Yıldırım, Ender/K-3962-2019
gdc.author.wosid Arikan, M. A. Sahir/Aaz-6632-2021
gdc.description.department Çankaya University en_US
gdc.description.departmenttemp [Cogun, Ferah; Yildirim, Ender] Cankaya Univ, Mech Engn Dept, TR-06790 Ankara, Turkey; [Cogun, Ferah; Arikan, M. A. Sahir] Middle East Tech Univ, Mech Engn Dept, Ankara, Turkey en_US
gdc.description.endpage 1844 en_US
gdc.description.issue 16 en_US
gdc.description.publicationcategory Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı en_US
gdc.description.scopusquality Q1
gdc.description.startpage 1838 en_US
gdc.description.volume 32 en_US
gdc.description.woscitationindex Science Citation Index Expanded
gdc.description.wosquality Q2
gdc.identifier.openalex W2606834176
gdc.identifier.wos WOS:000415709300006
gdc.openalex.fwci 0.96972837
gdc.openalex.normalizedpercentile 0.72
gdc.opencitations.count 27
gdc.plumx.crossrefcites 1
gdc.plumx.mendeley 36
gdc.plumx.scopuscites 32
gdc.scopus.citedcount 32
gdc.wos.citedcount 29
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