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Analytical Solution of Thermal Stresses In A Functionally Graded Solid Cylinder Within Parabolic Continuous Grading

dc.authorid Gulgec, Mufit/0000-0002-3911-2734
dc.authorid Ozturk, Ali/0000-0002-6357-1631
dc.authorscopusid 57225345074
dc.authorscopusid 6603123529
dc.authorwosid Ozturk, Ali/J-4076-2013
dc.contributor.author Ozturk, Ali
dc.contributor.author Gülgeç, Müfit
dc.contributor.author Gulgec, Mufit
dc.contributor.authorID 4168 tr_TR
dc.contributor.other Mekatronik Mühendisliği
dc.date.accessioned 2020-04-02T13:04:01Z
dc.date.available 2020-04-02T13:04:01Z
dc.date.issued 2013
dc.department Çankaya University en_US
dc.department-temp [Ozturk, Ali] Necmettin Erbakan Univ, Dept Mech Engn, Meram, Konya, Turkey; [Gulgec, Mufit] Cankaya Univ, Dept Mechatron Engn, Ankara, Turkey en_US
dc.description Gulgec, Mufit/0000-0002-3911-2734; Ozturk, Ali/0000-0002-6357-1631 en_US
dc.description.abstract This paper presents analytical solutions of the thermal stresses in a functionally graded solid cylinder with fixed ends in elastic region. These thermal stresses are due to the uniform heat generation inside the cylinder. Material properties of the functionally graded (FG) cylinder vary radially according to a parabolic form. The material properties are assumed to be independent of the temperature which are yield strength, elasticity modulus, thermal conduction coefficient, thermal expansion coefficient and Poisson's ratio. The solutions for the thermal stresses are valid for both homogeneous and functionally graded materials. en_US
dc.description.publishedMonth 12
dc.description.sponsorship Necmettin Erbakan University [121619008] en_US
dc.description.sponsorship Support of Necmettin Erbakan University is gratefully acknowledged (Grant No: 121619008). en_US
dc.description.woscitationindex Conference Proceedings Citation Index - Science
dc.identifier.citation Ozturk, Ali; Gulgec, Mufit, "Analytical Solution of Thermal Stresses in a Functionally Graded Solid Cylinder within Parabolic Continuous Grading", Mechatronics and Computational Mechanics, Vol. 307, pp. 364-, (2012) en_US
dc.identifier.doi 10.4028/www.scientific.net/AMM.307.364
dc.identifier.endpage + en_US
dc.identifier.isbn 9783037856598
dc.identifier.issn 1660-9336
dc.identifier.scopus 2-s2.0-84874605350
dc.identifier.scopusquality N/A
dc.identifier.startpage 364 en_US
dc.identifier.uri https://doi.org/10.4028/www.scientific.net/AMM.307.364
dc.identifier.volume 307 en_US
dc.identifier.wos WOS:000323583700072
dc.identifier.wosquality N/A
dc.language.iso en en_US
dc.publisher Trans Tech Publications Ltd en_US
dc.relation.ispartof International Conference on Mechatronics and Computational Mechanics (ICMCM 2012) -- DEC 20-21, 2012 -- Dubai, U ARAB EMIRATES en_US
dc.relation.ispartofseries Applied Mechanics and Materials
dc.relation.publicationcategory Konferans Öğesi - Uluslararası - Kurum Öğretim Elemanı en_US
dc.rights info:eu-repo/semantics/closedAccess en_US
dc.scopus.citedbyCount 2
dc.subject Functionally Graded Material (Fgm) en_US
dc.subject Continuous Grading en_US
dc.subject Thermal Stress en_US
dc.subject Solid Cylinder en_US
dc.title Analytical Solution of Thermal Stresses In A Functionally Graded Solid Cylinder Within Parabolic Continuous Grading tr_TR
dc.title Analytical Solution of Thermal Stresses in a Functionally Graded Solid Cylinder Within Parabolic Continuous Grading en_US
dc.type Conference Object en_US
dc.wos.citedbyCount 0
dspace.entity.type Publication
relation.isAuthorOfPublication 7ebf3a5e-253d-4e59-a442-7b444482f4cc
relation.isAuthorOfPublication.latestForDiscovery 7ebf3a5e-253d-4e59-a442-7b444482f4cc
relation.isOrgUnitOfPublication 5b0b2c59-0735-4593-b820-ff3847d58827
relation.isOrgUnitOfPublication.latestForDiscovery 5b0b2c59-0735-4593-b820-ff3847d58827

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