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Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components

dc.contributor.author Kocak, E.
dc.contributor.author Türkoǧlu, H.
dc.date.accessioned 2025-12-05T16:47:03Z
dc.date.available 2025-12-05T16:47:03Z
dc.date.issued 2026
dc.description.abstract In this study, heat transfer and temperature distribution characteristics of an electronic component covered with a porous medium were investigated both experimentally and numerically. An experimental setup was designed and constructed to conduct the experiments. For the numerical analysis, a computational fluid dynamics (CFD) software was developed on the OPENFOAM platform. The experimental results were used to validate the mathematical model and the computer program developed. The validated computer program was used to investigate the effects of Reynolds number, porosity, Darcy number, porous layer sizes, and the channel height on the heat transfer rate from the heat dissipating elements (electronic component) to the flow in wider ranges of the parameters. Using the Nusselt number values obtained both experimentally and numerically, a correlation equation was developed, and an artificial neural network architecture was trained for the Nusselt number. Results show that the Nusselt number increases with increasing Reynolds number, porosity, and the ratio of the height of the porous layer to the channel height. It was observed that the width of the porous medium has no noticeable effect on the Nusselt number. The correlation equation developed with four independent parameters predicts the Nusselt number with an average error of 7.59%. The artificial neural network architecture developed prevails as a more accurate tool, with a maximum error of 1%, for the prediction of the Nusselt number in the range of the parameters considered. © © 2026 by ASME. en_US
dc.identifier.doi 10.1115/1.4069986
dc.identifier.issn 1043-7398
dc.identifier.issn 1528-9044
dc.identifier.scopus 2-s2.0-105021457662
dc.identifier.uri https://doi.org/10.1115/1.4069986
dc.identifier.uri https://hdl.handle.net/20.500.12416/15753
dc.language.iso en en_US
dc.publisher American Society of Mechanical Engineers (ASME) en_US
dc.relation.ispartof Journal of Electronic Packaging en_US
dc.rights info:eu-repo/semantics/closedAccess en_US
dc.title Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components
dc.type Article en_US
dspace.entity.type Publication
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gdc.collaboration.industrial false
gdc.description.department Çankaya University en_US
gdc.description.departmenttemp [Kocak] Eyup, Department of Mechanical Engineering, Çankaya Üniversitesi, Ankara, Turkey; [Türkoǧlu] Haşmet, Department of Mechanical Engineering, Çankaya Üniversitesi, Ankara, Turkey en_US
gdc.description.endpage 51
gdc.description.issue 1 en_US
gdc.description.publicationcategory Makale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanı en_US
gdc.description.scopusquality Q2
gdc.description.startpage 1
gdc.description.volume 148 en_US
gdc.description.wosquality Q2
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